SUMEC TOUCH WORLD

TTV was established in the Penang Industrial Zone, Malaysia in 2001 and has been focusing on high-end AOI application technology for more than 20 years. Become the industry's first-class provider of intelligent optical inspection solutions for visualization of semiconductor and LED back-stage processes, and a provider of optical inspection and sorting solutions for solar wafer and cell manufacturing. It has become a major supplier of major international first-tier manufacturers in semiconductors, LED and photovoltaic industries.
Through unremitting efforts, TTV has firmly grasped the development opportunities of industry technology, continuously deepened its research and development capabilities in technology segments, and continuously explored cutting-edge issues in application fields from multiple dimensions such as lighting, camera technology, and dedicated algorithms. Continue to maintain technological leadership.

At the beginning of its establishment in 2001, TTV undertook R & D orders for product testing of flip-chip technology from the world's largest CPU manufacturing company at that time, and quickly achieved success. In the following years, it gradually promoted it to all CPU flip-chip technology companies.
In 2003, the company entered the field of packaging, testing and testing of discrete devices. With its excellent stability and accuracy, it has obtained orders from many major international manufacturers.
The first welding line inspection equipment was launched in 2007. In the 16 years since then, through the unremitting efforts of the technical team, this series of products has been in an international leading position.
The first photovoltaic testing equipment was launched in 2009, and now TT photovoltaic products have become the preferred supplier for major international manufacturers such as IBC.
In the same year, the company entered the research and development of full-process inspection solutions for SIP devices, and in 2012 began special inspection of die bond wires for IPM and other power products. In 2015, a detection solution for IGBTs was launched. And will become the largest AOI provider in this segment in 2022.& nbsp;
In 2013, the first wafer inspection equipment was launched. Since then, a number of application algorithms have been developed for different wafer processes and have been recognized by the market.
In 2015, special testing equipment for advanced packaging products such as 0201 size and CSP was launched.
In 2017, a power device AOI based on a fully independently developed true 3D algorithm was released
The F4X series products were launched in 2019 and were quickly recognized by the market.
In 2021, AXI dedicated equipment will be launched for IC X-ray testing
In 2023, we will launch multi-layer line 3D inspection products for MCU products.
Due to the continuous development in the technical field, the company has been recognized by the market with its technological advantages and good services. In the early stage of its launch, the company has been awarded the title of Top 100 Malaysian Small and Medium-sized Enterprises for many consecutive years, and in 2006, it was awarded the title of Top 500 Enterprises in Asia. As the company continues to grow, it will be successfully listed in Malaysia in early 2023.